BASCO IPPC-24H5-2L6C-15S Technical Parameters

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Industrial Panel PC Specification
LCD Display Touchscreen
Display Type 15″ TFT LCD (LED backlight) Touchscreen Type 5-Wire Resistive Projected Capacitive Non-Touchscreen
Resolution 1024*768 Touchscreen Method Single point Ten point –
Luminance 350 cd/m2 (Typ.) Surface 3H 6H 6H
Viewing Angle 89/89/89/89 (Typ.)(CR>=10) Durability 1 million touches – –
Contrast Ratio 1000:1 (Typ.) ( Transmission ) Transparency 75%±8% 85±3% >88%

 

System
CPU Model Intel® Core™ i7-1165G7 Intel® Core™ i5-1135G7 Intel® Core™ i3-1115G4 Intel® Celeron® 6305E
Graphic Intel® Iris® Xe Graphics, Up to 96 EUs,1.3Ghz Intel® Iris® Xe Graphics, Up to 80 EUs,1.3Ghz Intel® UHD Graphics, up to 48 EUs, 1.25Ghz
RAM SO-DIMM 2* non-ECC SO-DIMM Socket, support DDR4-3200 MHz, up to 64GB
Storage M.2 1* M.2 (NGFF) 2280 M-key Slot, support PCIex4 NVMe/ SATA3.0 SSD (PCIe x4 NVMe /SATA SSD sel by res, support SATA SSD by default. Intel® Core™ processor support Gen4 NVMe SSD, Intel® Celeron® processor support Gen3 NVMe SSD)
Supported OS Windows & Linux Win 8, Win 10; Win 10 IoT, Ubuntu, Dibian, Kali, CentOS, etc.
I/O INTERFACE COM 3 * RS232 (COM1/2/3, Header, Full lanes); 2 * RS232/TTL (COM4/5, Header, 3 lanes) ; 1 * RS232/RS485/TTL (COM6, Header, 3 lanes) (COM4/5/6 RS232/TTL sel by res, support RS232 by default. COM4/5/6 must be used at the same mode)
Ethernet 2 * Intel® GBE LAN Chip (10/100/1000 Mbps, RJ45)
USB 6* USB3.0; 4 * USB2.0 Internal Headers
Video 2* HDMI(TYPE-A), max resolution up to 4096*2160@30Hz
Audio 1 * Line-Out + MIC 2in1 3.5mm Jack; With 7.1 channel HD Audio Codec Realtek ALC897; 1 * Amplifier Header
SIM 1* Built-in nano-SIM Card Slot connected to M.2 B-key slot
Power Supply 12V DC; 1* DC Threaded Jack (5.5* 2.5mm)
Optional 9-30V DC PWR module with Terminal Block (2-Pin, 5.08mm)
Other 1* 8-bit GPIO header with 4 inputs and 4 outputs, Input voltage range: 0-5V;
Extended Capabilities Additional Internal Interface 1* M.2 (NGFF) E-key Slot (PCIe+USB2.0, Support WiFi+BT, 2230)
1* M.2 (NGFF) B-key Slot (PCIe/USB3.0+USB2.0, Support 5G+4G/3G, with 1* nano-SIM Card Slot, 3052)
Environment Operating Temperature Non-Touch: 0~50°C; Capacitive: -20~60°C; (w/ 0.7m/s Airflow)
Storage Temperature Non-Touch: 0 ~ 50°C; Capacitive: -20 ~ 60°C
Relative Humidity 40 °C @ 95%, Non-Condensing
Physical Characteristics Dimensions 357*283*55.5 mm
Net Weight Around 4.2kg (The final weight is subject to actual ordering configuration)
Regulation EMC CE/FCC Class B, CCC
Safety CE-LVD, RoHS, CCC

 

Optional Processor
CPU Code Name Total Cores Total Threads Max Turbo Frequency Base Frequency Cache TDP Memory Types Integrated Graphics
Intel® Core™ I7-1165G7 Tiger Lake 4 8 4.70 GHz 2.80 GHz 12 MB Intel® Smart Cache 12-28W DDR4 Intel®Iris Xe Graphics; 96Eus
Intel® Core™ I5-1135G7 Tiger Lake 4 8 4.20 GHz 2.40 GHz 8 MB Intel® Smart Cache 12-28W DDR4 Intel®Iris Xe Graphics; 80Eus
Intel® Core™ I3-1115G4 Tiger Lake 2 4 4.10 GHz 1.70 GHz 4 MB Intel® Smart Cache 12-28W DDR4 Intel®Iris Xe Graphics; 48Eus
Intel® Celeron® 6305E Tiger Lake 2 2 – 1.80 GHz 4 MB Intel® Smart Cache 15W DDR4 Intel UHD Graphics
Optional Accessories
Optional Items Max Qty Description
DC9-30V TO DC-12V PWR module 1 PCB, Power supply voltage conversion module, connected by header
Isolated 8-bit GPIO, 9-26V 1 Phoenix Terminal connector, connected by jumper
Isolated RS-232 6 DB9 or Phoenix Terminal connector, connected by header
Isolated 8-bit GPIO, 9-24V 1 Phoenix Terminal connector, connected by header
4G Module 1 Connected by M.2 interface
5G Module 1 Connected by M.2 interface
WiFi Module without AP mode 1 Connected by M.2 interface
Drawings and Dimensions