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BASCO Industrial PC
Industrial Box PC IBPC-2301H-3L5C-2P 3 LAN 5 COM 12th/13th/14th CPU
$0.00 USD
the table display is not optimized for mobile devices. Please contact online customer service to obtain the data sheet.
High-performance Industrial Box PC Specification
| Model | IBPC-2301H-3L5C-2P | ||
| Supported OS | Win 10, Win 11, Linux (Ubuntu, Debian, Kali, CentOS, etc.); Win 10 IoT | ||
| Chipset | Intel® H770 Chipset, TDP 6W | ||
| CPU | Socket | Intel® Desktop Processors Socket LGA1700 | |
| Series | Gen.12/13/14 Intel® Core™ i3 processor (base TDP up to 65W) | Gen.12/13/14 Intel® Core™ i9/ i7/ i5 processor (base TDP up to 35W) | |
| Graphic | Intel® UHD Graphics 730, 24 Execution Units | Intel® HD Graphics 770, 32 Execution Units | |
| RAM | Type&Qty | 2* Dual-CH DDR4 3200 MHz SO-DIMM Socket, Capacity up to 64GB for single slot | |
| Storage Device | SATA | 1* 2.5″ SATA3.0 Bay on daughterboard (6Gb/s); 4* SATA3.0 connectors (6Gb/s), Support RAID 0/1/5/10 (SATA3&4 are colay with PCIex2 of NGFF1) | |
| MSATA | 1* mSATA3.0 slot on board (6Gb/s) | ||
| M.2 | 1* M.2 2280 M-key slot (NGFF3), support PCIex4 Gen.3 NVMe SSD (From CPU); 1* M.2 2280 M-key slot (NGFF1), support PCIex2 Gen.3 NVMe/ SATA3.0 SSD (From PCH, the PCIex2 signale is colay with SATA 3&4) | ||
| I/O Interface | COM | 4* Isolated DB9 COM Ports with ESD/EFT/Surge protection (COM1-4, support RS232/485, switchable by jumper); 1* RS232 with DB9 connector (COM5); 1* RS232 header (COM6) | |
| Ethernet | 2* Intel® i210AT GbE LAN, RJ45 connector; 1* Intel® i219LM GbE LAN, RJ45 connector | ||
| USB | 4* USB3.2 Gen 2×1 (10Gb/s); 4* USB3.0 (5Gb/s); (USB3.0-1 is colay with M.2 B Key slot, USB3.0-2 is colay with Mini-PCIe slot on motherboard); 2* USB2.0, 1* Internal USB2.0 (480Mb/s, on daughterboard) | ||
| Video | 1* HDMI, Support 4096×2304 @24Hz +1* DP, Support 4096*2160 @60Hz; (Optional 2* DP, Support 4096 x 2304@60Hz); Optional with one more HDMI port, expanded by TP-IPC daughter card, supports 3 independent displays | ||
| Audio | 1* MIC, 1* SPK; With 7.1+2 channels HD (High Definition) Audio Codec Realtek ALC897 | ||
| SIM | 2* External SIM card slot, SIM 1 is connected to M.2 B-key slot, SIM2 is connected to Mini-PCIe slot on daughterboard; (Available with one more internal SIM card slot when using a LTE module with SIM card slot) | ||
| Power Supply | 9-36 VDC; 1* Terminal Block (4-Pin, 5.08mm) | ||
| Other | 1* 8-bit GPIO, Terminal Block (12-Pin, 3.81mm), 4-Inputs/4-Outputs, 0-5V Input Range; 1* Terminal Block (4-Pin, 3.81mm Pitch) with Remote Switch and Power Indicator; 1* PS/2 for keyboard/ mouse; 1* Auto-On Jumper; 1* TPM header (2*6-pin) | ||
| Extended Capabilities | Additional Internal Interface | 1* PCIe x4+1* PCIe x16 or 2* PCIe x8 or 1* PCI+1* PCIe x4 or 2* PCI or 1* PCI+1* PCIe x16; (Only PCIex16 is Gen.4); 1* M.2 3042/3052 B-key Slot with SIM card slot1 (USB3.0, USB signal is colay with USB1 on motherboard); 1* Full Size Mini-PCIe Slot (PCIe+USB2.0, on motherboard, without SIM card slot, USB signal iss colay with USB2 on motherboard); 1* Full Size Mini-PCIe Slot with SIM card slot2 (PCIe+USB2.0, on daughterboard); 1* M.2 2230 E-key Slot (PCIe+USB2.0, support CNVi, WiFi+BT) | |
| Environment | Operating Temp. | -10 ~ 55 °C w/ 0.7m/s Airflow | |
| Storage Temp. | -40 ~ 85 °C (-40~185 °F) | ||
| Relative Humidity | 40 °C @ 95%, Non-Condensing | ||
| Physical Characteristics | Dimensions | 290.35* 132.38* 186 mm (W* H* D) | |
| Net Weight | 4.55 KG | ||
| Regulation | EMC | CE/FCC Class B, CCC | |
| Safety | CE-LVD, RoHS, CCC | ||
Optional Processor
| CPU | Code Name | Total Cores | Total Threads | Max Turbo Frequency | Base Frequency | Cache | TDP | Memory Types | Integrated Graphics |
| Intel® Core™ I3-12100T | Alder Lake | 4 | 8 | 4.10 GHz | 2.20 GHz | 12 MB | 35 W | DDR4 | Intel® HD Graphics 730, 24EUs |
| Intel® Core™ I5-12500T | Alder Lake | 6 | 12 | 4.40 GHz | 2.00 GHz | 18 MB | 35 W | DDR4 | Intel® HD Graphics 770, 32EUs |
| Intel® Core™ I7-12700T | Alder Lake | 12 | 20 | 4.70 GHz | 1.40 GHz | 25 MB | 35 W | DDR4 | Intel® HD Graphics 770, 32EUs |
| Intel® Core™ I9-12900T | Alder Lake | 16 | 24 | 4.90 GHz | 1.40 GHz | 30 MB | 35 W | DDR4 | Intel® HD Graphics 770, 32EUs |
| Intel® Core™ I3-12100 | Alder Lake | 4 | 8 | 4.30 GHz | 3.30 GHz | 12 MB | 65 W | DDR4 | Intel® HD Graphics 730, 24EUs |
| Intel® Core™ I5-12500 | Alder Lake | 6 | 12 | 4.60 GHz | 3.00 GHz | 18 MB | 65 W | DDR4 | Intel® HD Graphics 770, 32EUs |
| Intel® Core™ I3-13100T | Raptor Lake | 4 | 8 | 4.10 GHz | 2.20 GHz | 12 MB | 35 W | DDR4 | Intel® HD Graphics 730, 24EUs |
| Intel® Core™ I5-13500T | Raptor Lake | 14 | 20 | 4.40 GHz | 2.00 GHz | 24 MB | 35 W | DDR4 | Intel® HD Graphics 770, 32EUs |
| Intel® Core™ I7-13700T | Raptor Lake | 16 | 24 | 4.70 GHz | 1.40 GHz | 30 MB | 35 W | DDR4 | Intel® HD Graphics 770, 32EUs |
| Intel® Core™ I9-13900T | Raptor Lake | 24 | 32 | 4.90 GHz | 1.40 GHz | 36 MB | 35 W | DDR4 | Intel® HD Graphics 770, 32EUs |
| Intel® Core™ I3-13100 | Raptor Lake | 4 | 8 | 4.30 GHz | 3.30 GHz | 12 MB | 65 W | DDR4 | Intel® HD Graphics 730, 24EUs |
| Intel® Core™ I3-14100T | Raptor Lake | 4 | 8 | 4.40 GHz | 2.70 GHz | 12 MB | 35 W | DDR4 | Intel® HD Graphics 730, 24EUs |
| Intel® Core™ I5-14500T | Raptor Lake | 14 | 20 | 4.80 GHz | 1.70 GHz | 24 MB | 35 W | DDR4 | Intel® HD Graphics 770, 32EUs |
| Intel® Core™ I7-14700T | Raptor Lake | 20 | 28 | 5.20 GHz | 1.30 GHz | 33 MB | 35 W | DDR4 | Intel® HD Graphics 770, 32EUs |
| Intel® Core™ I9-14900T | Raptor Lake | 24 | 32 | 5.50 GHz | 1.10 GHz | 36 MB | 35 W | DDR4 | Intel® HD Graphics 770, 32EUs |
| Intel® Core™ I3-14100 | Raptor Lake | 4 | 8 | 4.70 GHz | 3.50 GHz | 12 MB | 65 W | DDR4 | Intel® HD Graphics 730, 24EUs |
Optional Accessories
| Optional Items | Max Qty | Description |
| Isolated RS-232 | 1 | DB9 or Phoenix Terminal connector, connected by header |
| Non-Isolated RS-232 | 1 | DB9 or Phoenix Terminal connector, connected by header |
| Non-Isolated RS-422 | 1 | DB9 or Phoenix Terminal connector, connected by header with a transform module |
| Non-Isolated RS-485 | 1 | DB9 or Phoenix Terminal connector, connected by header with a transform module |
| Isolated 8-bit GPIO, 9-24V | 1 | Phoenix Terminal connector, connected by header |
| Isolated 8-bit GPIO with current loading, 9-26V | 1 | Digital signal, Phoenix Terminal connector, connected by non-standard M.2 interface |
| 4G Module | 1 | Connected by Mini-PCIe interface |
| WiFi Module without AP mode | 1 | Connected by Mini-PCIe interface, M.2 interface or internal USB interface |
| WiFi Module with AP mode | 1 | Connected by Mini-PCIe interface |
| Dual channel CAN-Bus Module | 2 | Connected by Mini-PCIe or M.2 interface |
| Dual GbE PoE LAN Module | 1 | Connected by Mini-PCIe Interface |
Drawings and Dimensions
BASCO Industrial PC
Industrial Box PC IBPC-2301H-3L5C-2P 3 LAN 5 COM 12th/13th/14th CPU
$0.00 USD
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About Industrial Box PC IBPC-2301H-3L5C-2P 3 LAN 5 COM 12th/13th/14th CPU
the table display is not optimized for mobile devices. Please contact online customer service to obtain the data sheet.
High-performance Industrial Box PC Specification
| Model | IBPC-2301H-3L5C-2P | ||
| Supported OS | Win 10, Win 11, Linux (Ubuntu, Debian, Kali, CentOS, etc.); Win 10 IoT | ||
| Chipset | Intel® H770 Chipset, TDP 6W | ||
| CPU | Socket | Intel® Desktop Processors Socket LGA1700 | |
| Series | Gen.12/13/14 Intel® Core™ i3 processor (base TDP up to 65W) | Gen.12/13/14 Intel® Core™ i9/ i7/ i5 processor (base TDP up to 35W) | |
| Graphic | Intel® UHD Graphics 730, 24 Execution Units | Intel® HD Graphics 770, 32 Execution Units | |
| RAM | Type&Qty | 2* Dual-CH DDR4 3200 MHz SO-DIMM Socket, Capacity up to 64GB for single slot | |
| Storage Device | SATA | 1* 2.5″ SATA3.0 Bay on daughterboard (6Gb/s); 4* SATA3.0 connectors (6Gb/s), Support RAID 0/1/5/10 (SATA3&4 are colay with PCIex2 of NGFF1) | |
| MSATA | 1* mSATA3.0 slot on board (6Gb/s) | ||
| M.2 | 1* M.2 2280 M-key slot (NGFF3), support PCIex4 Gen.3 NVMe SSD (From CPU); 1* M.2 2280 M-key slot (NGFF1), support PCIex2 Gen.3 NVMe/ SATA3.0 SSD (From PCH, the PCIex2 signale is colay with SATA 3&4) | ||
| I/O Interface | COM | 4* Isolated DB9 COM Ports with ESD/EFT/Surge protection (COM1-4, support RS232/485, switchable by jumper); 1* RS232 with DB9 connector (COM5); 1* RS232 header (COM6) | |
| Ethernet | 2* Intel® i210AT GbE LAN, RJ45 connector; 1* Intel® i219LM GbE LAN, RJ45 connector | ||
| USB | 4* USB3.2 Gen 2×1 (10Gb/s); 4* USB3.0 (5Gb/s); (USB3.0-1 is colay with M.2 B Key slot, USB3.0-2 is colay with Mini-PCIe slot on motherboard); 2* USB2.0, 1* Internal USB2.0 (480Mb/s, on daughterboard) | ||
| Video | 1* HDMI, Support 4096×2304 @24Hz +1* DP, Support 4096*2160 @60Hz; (Optional 2* DP, Support 4096 x 2304@60Hz); Optional with one more HDMI port, expanded by TP-IPC daughter card, supports 3 independent displays | ||
| Audio | 1* MIC, 1* SPK; With 7.1+2 channels HD (High Definition) Audio Codec Realtek ALC897 | ||
| SIM | 2* External SIM card slot, SIM 1 is connected to M.2 B-key slot, SIM2 is connected to Mini-PCIe slot on daughterboard; (Available with one more internal SIM card slot when using a LTE module with SIM card slot) | ||
| Power Supply | 9-36 VDC; 1* Terminal Block (4-Pin, 5.08mm) | ||
| Other | 1* 8-bit GPIO, Terminal Block (12-Pin, 3.81mm), 4-Inputs/4-Outputs, 0-5V Input Range; 1* Terminal Block (4-Pin, 3.81mm Pitch) with Remote Switch and Power Indicator; 1* PS/2 for keyboard/ mouse; 1* Auto-On Jumper; 1* TPM header (2*6-pin) | ||
| Extended Capabilities | Additional Internal Interface | 1* PCIe x4+1* PCIe x16 or 2* PCIe x8 or 1* PCI+1* PCIe x4 or 2* PCI or 1* PCI+1* PCIe x16; (Only PCIex16 is Gen.4); 1* M.2 3042/3052 B-key Slot with SIM card slot1 (USB3.0, USB signal is colay with USB1 on motherboard); 1* Full Size Mini-PCIe Slot (PCIe+USB2.0, on motherboard, without SIM card slot, USB signal iss colay with USB2 on motherboard); 1* Full Size Mini-PCIe Slot with SIM card slot2 (PCIe+USB2.0, on daughterboard); 1* M.2 2230 E-key Slot (PCIe+USB2.0, support CNVi, WiFi+BT) | |
| Environment | Operating Temp. | -10 ~ 55 °C w/ 0.7m/s Airflow | |
| Storage Temp. | -40 ~ 85 °C (-40~185 °F) | ||
| Relative Humidity | 40 °C @ 95%, Non-Condensing | ||
| Physical Characteristics | Dimensions | 290.35* 132.38* 186 mm (W* H* D) | |
| Net Weight | 4.55 KG | ||
| Regulation | EMC | CE/FCC Class B, CCC | |
| Safety | CE-LVD, RoHS, CCC | ||
Optional Processor
| CPU | Code Name | Total Cores | Total Threads | Max Turbo Frequency | Base Frequency | Cache | TDP | Memory Types | Integrated Graphics |
| Intel® Core™ I3-12100T | Alder Lake | 4 | 8 | 4.10 GHz | 2.20 GHz | 12 MB | 35 W | DDR4 | Intel® HD Graphics 730, 24EUs |
| Intel® Core™ I5-12500T | Alder Lake | 6 | 12 | 4.40 GHz | 2.00 GHz | 18 MB | 35 W | DDR4 | Intel® HD Graphics 770, 32EUs |
| Intel® Core™ I7-12700T | Alder Lake | 12 | 20 | 4.70 GHz | 1.40 GHz | 25 MB | 35 W | DDR4 | Intel® HD Graphics 770, 32EUs |
| Intel® Core™ I9-12900T | Alder Lake | 16 | 24 | 4.90 GHz | 1.40 GHz | 30 MB | 35 W | DDR4 | Intel® HD Graphics 770, 32EUs |
| Intel® Core™ I3-12100 | Alder Lake | 4 | 8 | 4.30 GHz | 3.30 GHz | 12 MB | 65 W | DDR4 | Intel® HD Graphics 730, 24EUs |
| Intel® Core™ I5-12500 | Alder Lake | 6 | 12 | 4.60 GHz | 3.00 GHz | 18 MB | 65 W | DDR4 | Intel® HD Graphics 770, 32EUs |
| Intel® Core™ I3-13100T | Raptor Lake | 4 | 8 | 4.10 GHz | 2.20 GHz | 12 MB | 35 W | DDR4 | Intel® HD Graphics 730, 24EUs |
| Intel® Core™ I5-13500T | Raptor Lake | 14 | 20 | 4.40 GHz | 2.00 GHz | 24 MB | 35 W | DDR4 | Intel® HD Graphics 770, 32EUs |
| Intel® Core™ I7-13700T | Raptor Lake | 16 | 24 | 4.70 GHz | 1.40 GHz | 30 MB | 35 W | DDR4 | Intel® HD Graphics 770, 32EUs |
| Intel® Core™ I9-13900T | Raptor Lake | 24 | 32 | 4.90 GHz | 1.40 GHz | 36 MB | 35 W | DDR4 | Intel® HD Graphics 770, 32EUs |
| Intel® Core™ I3-13100 | Raptor Lake | 4 | 8 | 4.30 GHz | 3.30 GHz | 12 MB | 65 W | DDR4 | Intel® HD Graphics 730, 24EUs |
| Intel® Core™ I3-14100T | Raptor Lake | 4 | 8 | 4.40 GHz | 2.70 GHz | 12 MB | 35 W | DDR4 | Intel® HD Graphics 730, 24EUs |
| Intel® Core™ I5-14500T | Raptor Lake | 14 | 20 | 4.80 GHz | 1.70 GHz | 24 MB | 35 W | DDR4 | Intel® HD Graphics 770, 32EUs |
| Intel® Core™ I7-14700T | Raptor Lake | 20 | 28 | 5.20 GHz | 1.30 GHz | 33 MB | 35 W | DDR4 | Intel® HD Graphics 770, 32EUs |
| Intel® Core™ I9-14900T | Raptor Lake | 24 | 32 | 5.50 GHz | 1.10 GHz | 36 MB | 35 W | DDR4 | Intel® HD Graphics 770, 32EUs |
| Intel® Core™ I3-14100 | Raptor Lake | 4 | 8 | 4.70 GHz | 3.50 GHz | 12 MB | 65 W | DDR4 | Intel® HD Graphics 730, 24EUs |
Optional Accessories
| Optional Items | Max Qty | Description |
| Isolated RS-232 | 1 | DB9 or Phoenix Terminal connector, connected by header |
| Non-Isolated RS-232 | 1 | DB9 or Phoenix Terminal connector, connected by header |
| Non-Isolated RS-422 | 1 | DB9 or Phoenix Terminal connector, connected by header with a transform module |
| Non-Isolated RS-485 | 1 | DB9 or Phoenix Terminal connector, connected by header with a transform module |
| Isolated 8-bit GPIO, 9-24V | 1 | Phoenix Terminal connector, connected by header |
| Isolated 8-bit GPIO with current loading, 9-26V | 1 | Digital signal, Phoenix Terminal connector, connected by non-standard M.2 interface |
| 4G Module | 1 | Connected by Mini-PCIe interface |
| WiFi Module without AP mode | 1 | Connected by Mini-PCIe interface, M.2 interface or internal USB interface |
| WiFi Module with AP mode | 1 | Connected by Mini-PCIe interface |
| Dual channel CAN-Bus Module | 2 | Connected by Mini-PCIe or M.2 interface |
| Dual GbE PoE LAN Module | 1 | Connected by Mini-PCIe Interface |
Drawings and Dimensions
Explore More Industrial Control Products
Customer Reviews
Fulcrum Control Technologies
We needed several mini PCs for different automation tasks and found BASCO during our search for compact industrial systems. Their team quickly understood our requirements and made the necessary hardware adjustments without complicating the process. Communication was smooth, response time was fast, and—even with customization—the delivery timeline exceeded expectations. Pricing was reasonable compared with other industrial suppliers. For anyone looking for reliable mini PCs with flexible configuration options, BASCO is a solid choice.
Takamul Automation Group
After facing repeated production downtime due to overheating in our legacy controllers, we searched for industrial computers with strong environmental resistance. BASCO stood out with their IP67-rated units and TÜV-certified vibration compliance, which gave us confidence to deploy them in our automotive welding lines. Their systems offered a cost advantage without compromising build quality. Since installation, we’ve seen significantly more stable operation under the tough thermal and EMI conditions of our facility.
DeltaSync Industrial
We began working with BASCO after meeting their engineering team at Hannover Messe 2019. Their technical depth became clear early on: they optimized our testing cycle through remote customization, pinpointed an EMC-related alignment issue we had struggled to diagnose, and helped reduce long-term maintenance costs through a structured TCO program. Based on consistent performance and engineering support, we upgraded BASCO to our Tier-1 supplier list and extended our partnership through 2030.
Präzision Dynamics
After three years of continuous operation in our machining environment, BASCO’s rugged systems have demonstrated impressive reliability. Their engineers supported us through detailed hardware hardening and ensured smooth integration with our existing automation layer. Though custom builds took additional time, the return on investment has been clear: stable 24/7 performance, reduced unplanned downtime, and a predictable lifecycle plan that helps lower our equipment refresh costs.
Dhruva Nanotech
Integrating new industrial PCs into our legacy control infrastructure was a major challenge, but BASCO handled it professionally from the start. Their team planned a phased migration that allowed us to upgrade with zero downtime. The redundant hardware design eliminated several failure points in our old system. What we appreciate most is their proactive lifecycle support—keeping our compliance standards current and giving us clear upgrade guidance ahead of regulatory changes.
Sílício Brasil
When our fab’s legacy controllers started showing signs of instability, BASCO provided replacement units on a surprisingly tight schedule. Their IPCs were compatible with our older drivers and introduced useful improvements like real-time thermal monitoring. The custom ESD-safe configuration took additional coordination but worked flawlessly once deployed. Since installation, we haven’t experienced any unexpected outages, and firmware updates have strengthened system security without disrupting operations.
Yantrix
In our Chennai plant, seasonal heat and dust caused frequent shutdowns in our previous computers. BASCO’s heat-resilient motherboards and IP-rated enclosures significantly reduced these incidents. Their local engineering support was particularly valuable—they understood India’s grid fluctuations and delivered surge-hardened systems that other vendors couldn’t provide. Since implementation, emergency repair calls have dropped noticeably, and overall equipment lifespan has improved.
AmandlaGrid
In our African operations, high ambient temperatures and unstable power grids often push control systems to their limits. BASCO supplied temperature-resilient motherboards and IP66 dust-proof IPCs that performed reliably even under 48°C conditions. Their engineers also helped stabilize our power input with supercapacitor-based solutions. While customization extended lead times slightly, the improvements in system lifespan and reduction in failures have been substantial.
Технопром Автоматика
Our Siberian plant requires equipment that can start and operate in extremely low temperatures. BASCO’s cold-resistant industrial PCs performed reliably where several competitor units had failed. Their protective coatings also helped reduce corrosion issues caused by smelting fumes. After deployment, we recorded fewer temperature-related failures and smoother integration with our older PLC systems. For operations in harsh winter climates, BASCO has proven to be a dependable partner.
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